Design Methodology for Adhesively- Bonded Joints developped by CETIM

Créé le : 06/02/2019

This methodology consists of a competitive and fast pre-design step of the bonded joint using analytical methods and enables the designer to check the good geometrical parameters (overlap length, adhesive thickness…) and characteristics of the adhesive (modulus, “yield” stress…) for meeting the technical requirements of the assembly. The FEA is only used at the final step for verification.